Date and Time:

Friday, February 28, 2025

Format

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Online（Zoom）

Program

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16:00～16:40

「Competing in Semiconductor Packaging Development Through Business Models」

Mr. Mamoru Ando (Executive Director & Senior Managing Executive Officer, Connectec Japan Corporation)

 In the rapidly evolving field of semiconductor development, not only device development but also packaging technologies—such as materials, processes, and equipment—have become indispensable. Competing with overseas players in terms of financial power and resources is challenging, while in-house development faces issues of speed and breakthrough capabilities. This presentation will introduce the background, business model, and achievements of a company with fewer than 50 employees handling nearly 400 development projects annually.

16:40～17:20

 「Copper Wiring Formation Using Light Sintering Technology with Cuprous Oxide Paste 'Curelight®'」

Mari Akikawa (Circuit Materials Group, Circuit Materials Research Department, R&D Division, Nippon Chemical Industrial Co., Ltd.)

 Nippon Chemical Industrial has developed Curelight®, a cuprous oxide paste that enables copper wiring formation on various films using a xenon flash lamp. In this presentation, we will explain light sintering technology, cuprous oxide particles, and Curelight®. Additionally, we will introduce some application examples.

 

Contact Information

YU-SSC Secretariat, Yamagata University
E-mail: soft-sensing@gp.yz.yamagata-u.ac.jp